With the rapid application of PVD plating technology, vacuum plating equipment has attracted domestic and foreign experts and related companies to actively research and develop. So far, whether it is PVD deposition technology, PVD preparation technology, or PVD equipment supporting equipment and components, there has been a great deal. progress.

1. Cold cathode arc

The cathodic arc technique is to vaporize and ionize the target into a plasma state by a low voltage and high current arc discharge under vacuum conditions, thereby realizing deposition of the film material. Recently, there have been new developments in cathode arc evaporation sources, mainly through the effective design of effective forced cooling and electromagnetic fields. Under the combined action of the two, the ionization rate of the target is higher and the film performance is more excellent.

2. Magnetic filter cathode arc

Equipped with a high-efficiency electromagnetic filtration system, the large particles such as neutral macroscopic particles and molecular groups in the plasma generated by the arc are filtered, and the ionization rate of the deposited particles after magnetic filtration is 100%, so the prepared film is very dense and It is smooth and smooth, has good corrosion resistance and stronger bonding with the substrate.

3. Columnar or planar large area arc source

While ensuring high ionization rate, the proportion of large particle deposition is reduced, achieving both good adhesion and good surface finish.

4. Medium frequency magnetron sputtering

Increasing the ionization rate, reducing the abnormal discharge caused by charge accumulation, preventing the target surface poisoning phenomenon, and the deposition process is more stable.

5. Fully enclosed unbalanced magnetron sputtering

Through the action of the fully enclosed unbalanced electromagnetic field, the ionization rate and deposition rate in the vacuum chamber are greatly improved, and the film-based bonding force and the uniformity of film deposition are enhanced.

6. Pulse high energy narrow peak DC sputtering

Increase the instantaneous bombardment energy and the ionization rate of the sputtering target (up to 50% to 60%), close to the ionization rate of the arc. The energy of the deposited ions can be greatly increased by the action of the electromagnetic field, thereby improving the adhesion and compactness of the film layer.

7. Anode layer ion source assisted deposition

Improve the quality of bombardment cleaning, especially for pre-plating cleaning of non-conductors, assisting deposition during coating, increasing the energy of deposited particles, and improving the bonding strength of the film.

8. Nano composite multilayer film

The nano-deposition technology is the future development direction of the coating structure. The coating structure is greatly enhanced by depositing a composite film with different thicknesses of nanometer thickness.

9. Decorative two-color plating

The single color PVD coating can not meet the market demand, and then the requirements of two-color plating are proposed. This is the development direction of decorative coating. The quality of the two-color plating has become the production technology level of PVD processing enterprises.

10. High energy pulse superimposed DC bias

Reduce the ignition of the workpiece, increase the deposition ion energy, enhance the film-based bonding force, and increase the deposition rate.

11. Ultra-low temperature capture pump

Through the low-temperature condensation effect, the residual gas in the vacuum system, especially water vapor, is quickly captured, which greatly shortens the vacuuming time and obtains a clean vacuum environment.

12. Molecular pump and cryogenic pump

Green and environmental protection, greatly reducing energy consumption, stable pumping speed of vacuum system, stable and reliable coating process and good reproducibility. The cryogenic pump can also pump hard gas such as low saturated vapor pressure to ensure the cleanliness of the vacuum system.